Power chips are attached to exterior circuits through product packaging, and their efficiency relies on the assistance of the packaging. In high-power situations, power chips are normally packaged as power components. Chip interconnection refers to the electrical connection on the upper surface of the chip, which is typically aluminum bonding cord in standard components. ^
Typical power module plan cross-section
Today, business silicon carbide power modules still mostly make use of the packaging innovation of this wire-bonded typical silicon IGBT component. They deal with issues such as big high-frequency parasitic parameters, insufficient heat dissipation ability, low-temperature resistance, and inadequate insulation strength, which limit making use of silicon carbide semiconductors. The screen of excellent efficiency. In order to resolve these issues and totally make use of the massive possible advantages of silicon carbide chips, many new product packaging innovations and services for silicon carbide power modules have actually emerged in the last few years.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually established from gold cable bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have developed from gold wires to copper cords, and the driving force is cost reduction; high-power gadgets have established from aluminum cables (strips) to Cu Clips, and the driving force is to improve product performance. The greater the power, the higher the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that makes use of a solid copper bridge soldered to solder to link chips and pins. Compared to conventional bonding packaging methods, Cu Clip innovation has the adhering to benefits:
1. The connection in between the chip and the pins is made of copper sheets, which, to a specific degree, changes the basic wire bonding method between the chip and the pins. Consequently, an one-of-a-kind package resistance value, greater present circulation, and far better thermal conductivity can be acquired.
2. The lead pin welding area does not require to be silver-plated, which can completely save the expense of silver plating and bad silver plating.
3. The item look is entirely regular with regular items and is mainly used in servers, portable computers, batteries/drives, graphics cards, electric motors, power supplies, and other areas.
Cu Clip has 2 bonding techniques.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding method is a lot more expensive and intricate, however it can attain far better Rdson and much better thermal effects.
( copper strip)
Copper sheet plus cable bonding technique
The resource pad makes use of a Clip method, and the Gate utilizes a Cord technique. This bonding approach is slightly cheaper than the all-copper bonding method, conserving wafer area (applicable to extremely little gate areas). The process is easier than the all-copper bonding method and can get far better Rdson and better thermal impact.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper rounds, please feel free to contact us and send an inquiry.
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